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SOURCE FlipChip International
PHOENIX, June 9, 2014 /PRNewswire/ -- FlipChip International - (FCI), the global technology leader in flip chip bumping and wafer level packaging, announced that their CTO, Ted Tessier, will be presenting a collaborative paper with Fujikura Limited entitled "Enabling Wearable Electronics: Innovation Through Miniaturization" at the TechSearch International Packaging and Assembly Considerations in Wearable Electronics Workshop to be held in Austin, Texas on June 11th and 12th, 2014.
At the workshop, FCI and Fujikura will be presenting a unique perspective on medical and consumer wearable electronics from the vantage points of both a wafer level packaging solutions provider and a flex circuit manufacturing and assembly technology provider. This forward looking process technology and application vision is validated by more than 15 years of experience in supporting a large number of portable computing and communication product applications including smart phones and tablets. The successful development relationship with Fujikura in the area of embedded active and passive components in multilayer flexible circuit substrates and the miniaturized System in Package (SiP) solutions that they enable called WABETM and ChipsetTTM will be highlighted. The integrated suite of SIP packaging options enabled by Fujikura's global footprint of flex circuit manufacturing and assembly factories and FCI's dramatically increased capabilities in high volume IC Assembly and Test, following the acquisition of Millenium Microtech Shanghai, positions both of our companies to continue to make major technological strides in the wearable space. We are currently working closely with a number of the world's leading OEM's, integrated circuit foundries and fabless semiconductor companies on technical innovations that will enable the next generation of ubiquitous electronic applications.
Ted Tessier, FlipChip's CTO said, "FCI is pleased to participate in this workshop highlighting wearable electronics. FlipChip's technology leadership in advanced wafer level packaging supports a number of new customer developments in the emerging Wearable space. Fujikura has more than a decade of experience in supporting the ultra-high volume interconnection requirements and expectations of portable electronic product applications. This is a powerful combination of core competencies that will be key to successes in this growing market segment."
FlipChip International – (FCI) supplies turnkey semiconductor assembly and test services to the consumer, automotive, aerospace and medical industries through our leadership in high volume wafer level packaging and advanced packaging technologies. FCI was an early developer of Wafer-Level Chip Scale Packaging and remains the technology leader in this field with many patented technologies spanning from Cu Pillar Bumping, Spheron™ WLCSP, ChipsetT™ Embedded Die Packaging, and FlipChip on Leadframe assembly. FCI supports a wide range of customers from each industry, frequently partnering with them to engineer customized solutions. FCI has a global footprint, offering high volume advanced packaging services from ISO/TS 16949-certified factories located in Phoenix, AZ, Shanghai, China and at Nanium S.A. located in Porto, Portugal.
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